DH-3 Copper Clad Phenolic Paper Laminate

   The Copper Clad Phenolic Paper Laminate is made of cellulose paper impregnated with phenolic resins and claded copper foil under baking and pressing, it is used for substrate of various printed circuits
   The even edges of Copper Clad Phenolic Paper Laminate should be cut at right angles, free from delamination and crazes in section.
   There must be free fromblister between copper foil and bonded surface, the surface of copper clad shall be free from wrinkles, pon-holes, scratches, dents, rich-bond spot and foreign matters. If the surface of copper clad discolors or is dirtied. Washer with hydrochloric acid solution of density 1.02g/cm³ or suitable organic solvent.
   The surface of laminate sheet should be free from blisters, dents, scratches, poor-bond spot, foreign matters and so on.

Nominal area	Tolerances	Nominal thickness	Tolerance individual
1220x1020 or 1020x1020	+20 -5	0.5 0.8 1.0 1.2 1.5 1.6	+/-0.07 +/-0.09 +/-0.11 +/-0.12 +/-0.14 +/-0.14

Characteristics of the laminte sheet:

No.	items	Unit	Normal value
1	Peel strength	N/mm	>1.0
2	Dip soldering resistance 260 +5/-0℃ 10S		no delamination,blister

	Address:26# Jianshe Rd., Jiaojiang, Taizhou, Zhejiang, China 318000
	Tel:0086-576-88519521 88519943          Fax:0086-576-88519869
	E-mial:dimc@mail.tzptt.zj.cn